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copper plating intermediates

copper plating intermediates

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China Copper plating intermediates Bis-(sodium sulfopropyl)-disulfide (SPS) C6H12Na2O6S4 factory

Copper plating intermediates Bis-(sodium sulfopropyl)-disulfide (SPS) C6H12Na2O6S4

1) Product Features:Products that not contain inorganic sulfide and sulfite, copper sulfate does not increase turbidity, scientific analysis, product quality and stability.2) Quality Standards: Q/LZ 30... Read More
2016-02-22 15:31:47
China Copper plating additives THIOFLAVINE T (basic yellow 1) C17H19ClN2S factory

Copper plating additives THIOFLAVINE T (basic yellow 1) C17H19ClN2S

Product Name: BASIC YELLOW 1; THIOFLAVINE T; 2-[4-(dimethylamino)phenyl]-3,6-dimethyl-benzothiazoliuchloride; Benzothiazolium,2-[4-(dimethylamino)phenyl]-3,6-dimethyl-,chloride; LABOTEST-BB LT00451909; CI 49005... Read More
2016-02-22 15:31:47
China Copper plating leveling agent throwing agent basic purple dye LZ-20C factory

Copper plating leveling agent throwing agent basic purple dye LZ-20C

LZ-20C Chemical name: Basic Purple dye Appearance: Purple liquid Assay: min 3.5% Usage: Dye for A dose, with the function of leveling and throwing power, obtain full bright plating. LZ-20C,used as copper ... Read More
2016-02-22 15:31:48
China Copper plating chemical wetting agent leveling agent Polyether NP-2 factory

Copper plating chemical wetting agent leveling agent Polyether NP-2

NP-2 Chemical Name: Polyether Appearance: Yellowish to yellow liquid Assay: min 98% Usage: Acid Copper Plating wetting agent, basic leveling agent,can well improve the throwing power. Characteristics: good ... Read More
2016-02-22 15:31:48
China Copper plating wetting agent leveling agent Polyether NP-1 factory

Copper plating wetting agent leveling agent Polyether NP-1

NP-1 Chemical Name: Polyether Appearance: Yellowish to yellow liquid Assay: min 95% Usage: Acid Copper Plating wetting agent, basic leveling agent,can well improve the plating’s evenness Characteristics: ... Read More
2016-02-22 15:31:48
China Copper plating chemical intermediate 1,3-Propanesultone (1,3-PS) C3H6O3S factory

Copper plating chemical intermediate 1,3-Propanesultone (1,3-PS) C3H6O3S

Chemical Name:1,3-Propane sultone Molecular formula: C3H6O3S Molecular weight: 122.1 CAS NO.: 1120-71-4 EINCES: 214-317-9 1) Product Features: High purity, light in color, less water. 2) Quality Standards: Q/LZ ... Read More
2016-02-22 15:31:48
China Copper plating complexing agent N,N,N',N'-Tetrakis(2-hydroxypropyl)ethylenediamine factory

Copper plating complexing agent N,N,N',N'-Tetrakis(2-hydroxypropyl)ethylenediamine

EDTP(Q75) --- copper plating complexing agent Molecular formula: C14H32N2O4 Molecular weight: 292.42 CAS NO.:102-60-3 EINECS: 203-041-4 1) Quality Standards: Q/LZ 39-2008 Appearance: Colorless transparent ... Read More
2016-02-22 15:31:48
China plating brightener SODIUM 3-MERCAPTO-1-PROPANESULFONATE (MPS) C3H7O3S2Na factory

plating brightener SODIUM 3-MERCAPTO-1-PROPANESULFONATE (MPS) C3H7O3S2Na

MPS Application: Chemical name: 3-mercapto-1-propane sulfonic acid, sodium salt Appearance: White powder Assay: 90% min As brightener in acidic copper plating to improve the deposition of copper cotings for ... Read More
2016-02-22 15:31:48
China Electronics chemical intermediate THIOFLAVINE T (Basic Yellow 1) C17H19ClN2S factory

Electronics chemical intermediate THIOFLAVINE T (Basic Yellow 1) C17H19ClN2S

THIOFLAVINE T Product Name: BASIC YELLOW 1; THIOFLAVINE T; 2-[4-(dimethylamino)phenyl]-3,6-dimethyl-benzothiazoliuchloride; Benzothiazolium,2-[4-(dimethylamino)phenyl]-3,6-dimethyl-,chloride; LABOTEST-BB ... Read More
2016-02-22 15:31:48
China Copper plating intermediate Bis-(sodium sulfopropyl)-disulfide (SPS) C6H12Na2O6S4 factory

Copper plating intermediate Bis-(sodium sulfopropyl)-disulfide (SPS) C6H12Na2O6S4

SPS 1) Product Features: Products that not contain inorganic sulfide and sulfite, copper sulfate does not increase turbidity, scientific analysis, product quality and stability. 2) Quality Standards: Q/LZ 30... Read More
2016-02-22 15:31:48
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